Overview

AMD adaptive SoCs and FPGAs support many different memory technologies internal or external to the device. With programmable logic often being used as accelerators in processing platforms, many AMD devices support all cache coherent interfaces, including the CCIX open standard and CXL®.

  • Internal Memory: UltraScale+™ devices add 288 Kb UltraRAM to established internal memory types
  • High Bandwidth Memory: 3D IC memory for higher bandwidth relative to DDR4/DDR5 solutions
  • Parallel External Memory: Flexible interfaces to LPDDR5/5X, DDR5, LPDDR4/4X, DDR4, RLDRAM3, and QDRIV
  Versal™ Adaptive SoC UltraScale+ UltraScale™ 7 Series Spartan™ 6
Block RAM 239 Mb 94 Mb 36 Kb 50 Mb 4 Mb
UltraRAM 717 Mb 360 Mb
High Bandwidth Memory  (HBM) 32 GB 16 GB
External Max Data Rate 8533 Mb/s 4266 Mb/s 2400 Mb/s 1866 Mb/s 800 Mb/s

 

Internal Memory (HBM, RAM)

Integrated HBM and RAM

AMD products contain different types of internal memory for different design needs.

  • Distributed RAM uses LUTs for coefficient storage, state machines, and small buffers
  • Block RAM is useful for fast, flexible data storage and buffering
  • UltraRAM blocks each provide 288 Kb and can be cascaded for large on-chip storage capacity
  • HBM (High Bandwidth Memory) is ideal for high capacity with higher bandwidth relative to discrete memory solutions
  Versal Adaptive SoC UltraScale+ UltraScale 7 Series Spartan 6
Distributed RAM Size 64-bit 64-bit 64-bit 64-bit 64-bit
Distributed RAM Capacity Range 0.6 – 258 Mb 1.2 Mb – 48.3 Mb 4.1 Mb – 28.7 Mb 70 Kb – 21 Mb 75 Kb – 1.3 Mb
Block RAM Size 36 Kb 36 Kb 36 Kb 36 Kb 18 Kb
Block RAM Capacity Range 0.8 Mb – 239 Mb 5.3 Mb – 94.5 Mb 12.7 – 132.9 Mb 180 Kb – 66.1 Mb 216 Kb – 4.7 Mb
UltraRAM Size 288 Kb 288 Kb
UltraRAM Capacity Range 6.8 Mb – 717 Mb 90 Mb – 360 Mb
HBM Stack Size 8 GB – 16 GB 4 GB – 8 GB
HBM Capacity Range 8 GB – 32 GB 4 GB – 16 GB

External Memory Interfaces

AMD offers a comprehensive set of physical layer memory interfaces and memory controllers for varied bandwidth, efficiency, and low latency requirements. Based on a rigorous characterization process to determine specifications, supported interfaces include LPDDR5/5X and LPDDR4/4X components, DDR5, DDR4, and DDR3 components and multi-rank DIMMs, including UDIMM, SODIMM, and RDIMM. Refer to the following tools to plan your memory interface design and implementation:

AMD memory controllers are included in the Vivado™ IP Catalog at no extra charge.

Refer to the device data sheet for a full list of supported memory standards and maximum data rates.

Resources

Achieve Supply Resilience with AMD Programmable Devices and ISSI Memory

Design for long-lasting supply-chain resilience—combine AMD adaptable compute, ISSI long-lifecycle memory, and Avnet global distribution to help embedded designs stay production-ready amid supply-chain uncertainty.

Versal Memory and Network on Chip (NoC) Tutorials

Learn how to build designs leveraging the network on chip and integrated memory controllers on Versal adaptive SoCs.

Tackle Memory Bottlenecks with the Versal HBM Series

Take five minutes and learn all you need to know about leveraging High Bandwidth Memory to tackle memory bottlenecks in your next embedded design.

UltraRAM: Breakthrough Embedded Memory

UltraRAM is a new memory block in UltraScale+ families that enables up to 500 Mb of total on-chip storage, equating to a 6X increase in on-chip memory vs. 28 nm AMD FPGAs.

Memory Interfaces with UltraScale Architecture FPGAs

Devices based on AMD UltraScale architecture, used in conjunction with DDR4 DRAMs, provide highly significant gains over previous generations in memory interface bandwidth, flexibility, and power use efficiency.

Visit Documentation Hub

Find solution briefs, product datasheets, and more on the AMD Documentation Hub.

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