Overview
AMD adaptive SoCs and FPGAs support many different memory technologies internal or external to the device. With programmable logic often being used as accelerators in processing platforms, many AMD devices support all cache coherent interfaces, including the CCIX open standard and CXL®.
- Internal Memory: UltraScale+™ devices add 288 Kb UltraRAM to established internal memory types
- High Bandwidth Memory: 3D IC memory for higher bandwidth relative to DDR4/DDR5 solutions
- Parallel External Memory: Flexible interfaces to LPDDR5/5X, DDR5, LPDDR4/4X, DDR4, RLDRAM3, and QDRIV
| Block RAM | 239 Mb | 94 Mb | 36 Kb | 50 Mb | 4 Mb |
| UltraRAM | 717 Mb | 360 Mb | – | – | – |
| High Bandwidth Memory (HBM) | 32 GB | 16 GB | – | – | – |
| External Max Data Rate | 8533 Mb/s | 4266 Mb/s | 2400 Mb/s | 1866 Mb/s | 800 Mb/s |
Internal Memory (HBM, RAM)
Integrated HBM and RAM
AMD products contain different types of internal memory for different design needs.
- Distributed RAM uses LUTs for coefficient storage, state machines, and small buffers
- Block RAM is useful for fast, flexible data storage and buffering
- UltraRAM blocks each provide 288 Kb and can be cascaded for large on-chip storage capacity
- HBM (High Bandwidth Memory) is ideal for high capacity with higher bandwidth relative to discrete memory solutions
| Distributed RAM Size | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit |
| Distributed RAM Capacity Range | 0.6 – 258 Mb | 1.2 Mb – 48.3 Mb | 4.1 Mb – 28.7 Mb | 70 Kb – 21 Mb | 75 Kb – 1.3 Mb |
| Block RAM Size | 36 Kb | 36 Kb | 36 Kb | 36 Kb | 18 Kb |
| Block RAM Capacity Range | 0.8 Mb – 239 Mb | 5.3 Mb – 94.5 Mb | 12.7 – 132.9 Mb | 180 Kb – 66.1 Mb | 216 Kb – 4.7 Mb |
| UltraRAM Size | 288 Kb | 288 Kb | – | – | – |
| UltraRAM Capacity Range | 6.8 Mb – 717 Mb | 90 Mb – 360 Mb | – | – | – |
| HBM Stack Size | 8 GB – 16 GB | 4 GB – 8 GB | – | – | – |
| HBM Capacity Range | 8 GB – 32 GB | 4 GB – 16 GB | – | – | – |
External Memory Interfaces
AMD offers a comprehensive set of physical layer memory interfaces and memory controllers for varied bandwidth, efficiency, and low latency requirements. Based on a rigorous characterization process to determine specifications, supported interfaces include LPDDR5/5X and LPDDR4/4X components, DDR5, DDR4, and DDR3 components and multi-rank DIMMs, including UDIMM, SODIMM, and RDIMM. Refer to the following tools to plan your memory interface design and implementation:
- Memory Interface Planning Tool (Versal devices) determines which Versal devices are suitable for your memory interface needs
- Memory Performance Utility (UltraScale+ and UltraScale devices) determines the maximum rate for your configuration
- Max Interface Capacities Utility (UltraScale+ and UltraScale devices) determines the max number of interfaces for your device and package
- PCB Design Guides (Versal / UltraScale) ensure implementation success
- Memory IP Design Checklist (UltraScale+ and UltraScale devices) of design rules
AMD memory controllers are included in the Vivado™ IP Catalog at no extra charge.
Refer to the device data sheet for a full list of supported memory standards and maximum data rates.
Tools
AMD provides best-in-class tools to estimate memory performance, interface capacity, and power consumption to maximize performance-per-watt and accelerate design and implementation. Below are a variety of memory- and power-related tools to get started today.
Resources
Stay Informed
Join the adaptive SoC and FPGA notification list to receive the latest news and updates.